The recommended land pattern for NLV32T-015J-PF is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations, ensure that the component is mounted on a thermally conductive substrate, and provide a thermal via or thermal pad under the component to dissipate heat. The maximum operating temperature is 125°C, and the thermal resistance (Rth) is 35°C/W.
The recommended reflow soldering profile for NLV32T-015J-PF is a peak temperature of 260°C, with a dwell time above 220°C of 20-30 seconds. The temperature should rise at a rate of 3°C/second, and the cooling rate should be 6°C/second or slower.
Yes, NLV32T-015J-PF is compatible with lead-free soldering. The component is RoHS compliant and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
The moisture sensitivity level (MSL) of NLV32T-015J-PF is MSL 3, which means that the component can be exposed to a maximum of 168 hours at 30°C and 60% relative humidity before soldering.
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NLV32T-015J-PF Overview
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About TDK
TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.
