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NLV32T-R27J-EF - TDK

Description: TDK - NLV32T-R27J-EF - High Frequency Inductor, 270 nH, NLV32-EF Series, 450 mA, 1210 [3225 Metric], Wirewound, 0.36 ohm

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NLV32T-R27J-EF - TDK PCB footprint - Inductor Moulded - Inductor Moulded - NLV32T-
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NLV32T-R27J-EF - TDK  - 3D model - Inductor Moulded - NLV32T-
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NLV32T-R27J-EF Details

  • Manufacturer Part Number:

    NLV32T-R27J-EF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    1310

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.36 Ω

  • Inductance-Nom (L):

    0.27 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.2 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.45 A

  • Self Resonance Frequency:

    320 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    L BEND

  • Test Frequency:

    25.2 MHz

  • Tolerance:

    5%

NLV32T-R27J-EF Frequently Asked Questions (FAQs)

  • The recommended land pattern for NLV32T-R27J-EF can be found in the TDK Corporation's application note or footprint library. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • Handle the NLV32T-R27J-EF by the edges or the recommended handling areas to prevent damage to the component. Avoid touching the component's terminals or body to prevent electrostatic discharge (ESD) damage. Use ESD-safe materials and equipment during assembly.
  • The maximum storage temperature for NLV32T-R27J-EF is typically 40°C (104°F) according to TDK Corporation's storage and handling guidelines. Exceeding this temperature may affect the component's reliability and performance.
  • The NLV32T-R27J-EF is designed to operate in a normal environment with a relative humidity of 60% or less. If the component will be used in a humid environment, consider using a moisture-resistant coating or conformal coating to protect it from moisture ingress.
  • The thermal resistance of the NLV32T-R27J-EF is typically specified in the datasheet or can be obtained from TDK Corporation's technical support. The thermal resistance is an important parameter to consider when designing the component's thermal management and heat dissipation.

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NLV32T-R27J-EF Overview

Use the download button to access the NLV32T-R27J-EF schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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