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NLV37WZ07USG - onsemi

Description: Buffer, Non-Inverting 3 Element 1 Bit per Element Open Drain Output US8

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NLV37WZ07USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 CASE 493 ISSUE F
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NLV37WZ07USG - onsemi  - 3D model - Small Outline Packages - US8 CASE 493 ISSUE F
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NLV37WZ07USG Details

  • Manufacturer Part Number:

    NLV37WZ07USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0.4

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    3

  • Number of Inputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    6 ns

  • Propagation Delay (tpd):

    9.5 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NLV37WZ07USG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • Yes, the NLV37WZ07USG is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions and design guidelines.
  • The NLV37WZ07USG requires a specific power sequencing to prevent damage. Ensure that the input voltage (VIN) is applied before the enable signal (EN) is asserted.

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NLV37WZ07USG Overview

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