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NLV37WZ17USG - onsemi

Description: Designed for 1.65 to 5.5 V VCC Operation; Over Voltage Tolerant Inputs and Outputs; 24 mA Balanced Output Sink and Source Capability; LVTTL Compatible – Interface Capability with 5 V TTL Logic with VCC = 3 V; Near Zero Static Supply Current Substantially Reduces System Power Requirements; LVCMOS Compatible; Current Drive Capability is 24 mA at the Outputs; Chip Complexity: FETs = 94; Hysteresis Inputs for Improved noise immunity

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NLV37WZ17USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8
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NLV37WZ17USG - onsemi  - 3D model - Small Outline Packages - US8
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NLV37WZ17USG Details

  • Manufacturer Part Number:

    NLV37WZ17USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    37WZ

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    3

  • Number of Inputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    9.2 ns

  • Propagation Delay (tpd):

    9.2 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NLV37WZ17USG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Ensure the device is soldered within the recommended temperature range to prevent damage.
  • Handle the device in an ESD-controlled environment, using ESD-protective packaging, wrist straps, and mats. Ensure all equipment and tools are properly grounded.
  • A 10-22 μF X7R or X5R ceramic capacitor is recommended, depending on the specific application requirements. Ensure the capacitor is rated for the input voltage and has a low equivalent series resistance (ESR).

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