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NLVHC259ADR2G - onsemi

Description: Output Drive Capability: 10 LSTTL Loads; Outputs Directly Interface to CMOS, NMOS, and TTL; Operating Voltage Range: 2 to 6 V; Low Input Current: 1 A; High Noise Immunity Characteristic of CMOS Devices; These are PbFree Devices

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NLVHC259ADR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO-16 CASE 751B-05 ISSUE K
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NLVHC259ADR2G - onsemi  - 3D model - Small Outline Packages - SO-16 CASE 751B-05 ISSUE K
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NLVHC259ADR2G Details

  • Manufacturer Part Number:

    NLVHC259ADR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-16

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    HC/UH

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    D LATCH

  • Max I(ol):

    0.004 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    42 ns

  • Propagation Delay (tpd):

    175 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    LOW LEVEL

  • Width:

    3.9 mm

NLVHC259ADR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NLVHC259ADR2G should consider the following: keep the input and output traces short and symmetrical, use a solid ground plane, and place decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The NLVHC259ADR2G has a thermal pad that should be connected to a solid ground plane or a thermal relief pattern to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or PCB. Ensure good airflow around the device and consider using a heat sink if the device is expected to operate at high temperatures.
  • Although the datasheet specifies a minimum input voltage of 2.7V, it's recommended to operate the NLVHC259ADR2G with an input voltage between 3.0V and 5.5V for optimal performance and to ensure that the device remains within its specified operating conditions.
  • To ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, use a low-pass filter or a pi-filter on the output lines to reduce electromagnetic interference (EMI).
  • Although the datasheet doesn't specify a maximum operating frequency, the NLVHC259ADR2G is designed for high-speed applications and can operate up to 100 MHz or more, depending on the specific application and PCB layout. However, it's recommended to consult with onsemi's application engineers for specific guidance on high-frequency operation.

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