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NLVVHC1GT126DT1G - onsemi

Description: Designed for 2.0 V to 5.5 V VCC Operation; High Speed: tPD = 3.5ns (Typ) at V CC = 5V; Low Power Dissipation: ICC = 1µA (Max) at TA = 25°C; TTL-Compatible Inputs: VIL = 0.8V; VIH = 2.0V; CMOS-Compatible Outputs: VOH > 0.8VCC ; VOL < 0.1VCC @Load; Power Down Protection Provided on Inputs and Outputs; Balanced Propagation Delays; Pin and Function Compatible with Other Standard Logic Families; Chip Complexity: FETs = ≤ 100; Pb-Free Packages are Available

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NLVVHC1GT126DT1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NLVVHC1GT126DT1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NLVVHC1GT126DT1G Details

  • Manufacturer Part Number:

    NLVVHC1GT126DT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Package Description:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    AHC/VHC/H/U/V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    10.5 ns

  • Propagation Delay (tpd):

    16 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NLVVHC1GT126DT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using thermal interface materials and following proper PCB design guidelines.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection during handling and assembly, follow proper ESD handling procedures, use ESD-safe materials and equipment, and ensure that the device is properly grounded during assembly. It's also recommended to use ESD protection devices, such as diodes or resistors, in the circuit design.
  • The recommended storage and handling conditions for the NLVVHC1GT126DT1G include storing the devices in their original packaging, avoiding exposure to moisture, and keeping the devices away from direct sunlight and extreme temperatures.

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