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NLX1G74MUTCG - onsemi

Description: D Flip-Flops and JK Flip-Flops | NLX1G74

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PCB Footprints
NLX1G74MUTCG - onsemi PCB footprint - Other - Other - NLX1G74MUTCG-2
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3D Models
NLX1G74MUTCG - onsemi  - 3D model - Other - NLX1G74MUTCG-2
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NLX1G74MUTCG Details

  • Manufacturer Part Number:

    NLX1G74MUTCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    UQFN8 1.6x1.6, 0.5P

  • Pin Count:

    8

  • Manufacturer Package Code:

    523AN

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    CMOS

  • JESD-30 Code:

    S-XQCC-N8

  • Length:

    1.6 mm

  • Logic IC Type:

    D FLIP-FLOP

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC8,.06SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    13 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    1.6 mm

  • fmax-Min:

    250 MHz

NLX1G74MUTCG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power dissipation according to the datasheet.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures and use ESD-protective packaging and storage.
  • Yes, the NLX1G74MUTCG is AEC-Q100 qualified and suitable for automotive and high-reliability applications, but ensure you follow the recommended operating conditions and guidelines.
  • Consult the datasheet and application notes, check for proper PCB layout and thermal management, and use debugging tools like oscilloscopes and logic analyzers to identify the issue.

Trust Checks

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NLX1G74MUTCG Overview

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