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NLX2G08MUTCG - onsemi

Description: Logic Gates DUAL 2 INPUT AND GATE

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PCB Footprints
NLX2G08MUTCG - onsemi PCB footprint - Other - Other - UQFN-MU  Case 523AN-O
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NLX2G08MUTCG Details

  • Manufacturer Part Number:

    NLX2G08MUTCG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    UQFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    523AN

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    2G

  • JESD-30 Code:

    S-XQCC-N8

  • Length:

    1.6 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC8,.06SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    11.2 ns

  • Propagation Delay (tpd):

    10.5 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

NLX2G08MUTCG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path short and direct to the heat sink or thermal pad.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a heat sink or thermal pad, and consider using a thermal interface material (TIM) to improve heat transfer.
  • Exceeding the maximum junction temperature (TJ) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range.
  • Yes, the NLX2G08MUTCG is suitable for high-reliability and automotive applications, as it meets the relevant industry standards (e.g., AEC-Q101) and has been designed to withstand harsh environmental conditions.
  • The NLX2G08MUTCG has built-in ESD protection and latch-up prevention mechanisms, including diodes and resistors, to protect the device from electrostatic discharge and latch-up events.

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