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NLX2G66DMUTAG - onsemi

Description: Wide Vcc Operating Range: 1.65 V to 5.5 V; OVT up to +5.5 V for Control Pin; RON: Typically 5.5 Ω at Vcc = 4.5 V and Is = 32 mA; ESD Performance: > 5000 V HBM, > 400 V MM

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PCB Footprints
NLX2G66DMUTAG - onsemi PCB footprint - Other - Other - UDFN8 1.95x1.0, 0.5P
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3D Models
NLX2G66DMUTAG - onsemi  - 3D model - Other - UDFN8 1.95x1.0, 0.5P
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NLX2G66DMUTAG Details

  • Manufacturer Part Number:

    NLX2G66DMUTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    UDFN8 1.95x1 0.5

  • Package Description:

    UDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    517CA

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    1.95 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    8 Ω

  • On-state Resistance-Max (Ron):

    30 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.55 mm

  • Signal Current-Max:

    0.1 A

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    9 ns

  • Switch-on Time-Max:

    10 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NLX2G66DMUTAG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NLX2G66DMUTAG is -55°C to 150°C.
  • To ensure proper biasing, the gate-source voltage (Vgs) should be between 2.5V and 10V, and the drain-source voltage (Vds) should be between 1.5V and 20V.
  • To minimize parasitic inductance, use a compact PCB layout with short, wide traces, and place the FET close to the load. Avoid using vias under the FET, and use a solid ground plane to reduce inductance.
  • To protect the NLX2G66DMUTAG from ESD, use an ESD wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or die. Use ESD-sensitive handling and storage procedures.
  • The maximum current rating for the NLX2G66DMUTAG is 2.5A per channel, with a total current rating of 5A for both channels combined.

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