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NRVB130T1G - onsemi

Description: Guardring for Stress Protection; Low Forward Voltage; 125°C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8"; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model, C; Human Body Model, 3 Mechanical Characteristics; Reel Options: MBR130T1 = 3,000 per 7, reel/8 mm tape MBR130T3 = 10,000 per 13, reel/8 mm tape; Device Marking: B13; Polarity Designator: Cathode Band; Weight: 11.7 mg (approximately); Case: Epoxy, Molded; Finish: All External Surfaces Corrosion Resistant a

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Symbol
NRVB130T1G - onsemi - PCB symbol
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PCB Footprints
NRVB130T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123
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3D Models
NRVB130T1G - onsemi - 3D model - Small Outline Diode - SOD-123
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NRVB130T1G Details

  • Manufacturer Part Number:

    NRVB130T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    5.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVB130T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • The NRVB130T1G requires a bias voltage of 2.5V to 5.5V on the VCC pin, and the input voltage on the VIN pin should be within the recommended operating range. Ensure that the input voltage is stable and noise-free to prevent oscillations.
  • The maximum allowable power dissipation for the NRVB130T1G is 1.4W. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended operating range to prevent overheating.
  • The NRVB130T1G is sensitive to ESD. Handle the device by the body, and use an ESD wrist strap or mat to prevent static buildup. Ensure that the PCB is designed with ESD protection in mind, and consider adding ESD protection devices such as TVS diodes or ESD arrays.
  • The NRVB130T1G is designed to operate up to 1 GHz. However, the optimal operating frequency range depends on the specific application and PCB layout. Ensure that the device is properly matched and biased for optimal performance at the desired frequency.

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NRVB130T1G Overview

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