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NRVB140ESFT3G - onsemi

Description: Guarding for Stress Protection; Low Reverse Leakage; 175C Operating Junction Temperature; Epoxy Meets UL 94 V0 @ 0.125 in; Package Designed for Optimal Automated Board Assembly; ESD Rating: (Human Body Model = 3B, Machine Model = M4); NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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NRVB140ESFT3G Details

  • Manufacturer Part Number:

    NRVB140ESFT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123FL 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    498-01

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.51 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    30 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVB140ESFT3G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a proper biasing circuit to ensure optimal performance. A voltage regulator or a low-dropout regulator (LDO) can be used to regulate the input voltage.
  • The maximum allowed power dissipation for the NRVB140ESFT3G is 1.4 W. Exceeding this limit can cause the device to overheat and reduce its lifespan.
  • The device is sensitive to ESD. Handling the device by its pins or using an ESD wrist strap can help prevent damage. Additionally, using ESD protection devices such as TVS diodes or ESD arrays can provide additional protection.
  • The NRVB140ESFT3G is designed to operate at frequencies up to 1 GHz. Operating the device at frequencies above 1 GHz may affect its performance and reliability.

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NRVB140ESFT3G Overview

Use the download button to access the NRVB140ESFT3G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like NRVB1, or try a keyword search, such as Rectifier Diodes

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