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NRVB2045MFST1G - onsemi

Description: Low Power Loss / High Efficiency; New Package Provides Capability of Inspection and Probe After Board Mounting; Guardring for Stress Protection; Low Forward Voltage Drop; 150°C Operating Junction Temperature; Wettable Flacks Option Available; These are Pb−Free and Halide−Free Devices

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NRVB2045MFST1G - onsemi  - 3D model
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NRVB2045MFST1G Details

  • Manufacturer Part Number:

    NRVB2045MFST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN5 5X6, 1.27P (SO 8FL)

  • Manufacturer Package Code:

    488AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.32

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.61 V

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    600 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVB2045MFST1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the enable pin (EN) is VCC + 0.3V. Exceeding this voltage may damage the device.
  • Yes, but ensure that the switching frequency is within the recommended range (up to 1 MHz). Also, consider the device's power losses and thermal performance at high frequencies.
  • Use a voltage regulator or a TVS diode to protect against overvoltage. For overcurrent protection, use a fuse or a current-limiting resistor in series with the device.

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NRVB2045MFST1G Overview

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