Description:Compact Package with J–Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over–Voltage Protection; Low Forward Voltage Drop Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8 inch; Weight: 95 mg (approximately); Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Finish: All External Surfaces C
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the bottom layer.
The device requires a stable input voltage (VIN) and a bypass capacitor (CBYP) to ensure proper biasing. A 1uF ceramic capacitor is recommended for CBYP, and VIN should be decoupled with a 10uF capacitor.
The maximum allowed voltage on the input pin is 26V, as specified in the datasheet. Exceeding this voltage may damage the device.
The device has a built-in overcurrent protection (OCP) feature that limits the output current to 3.5A. However, it is still recommended to add external overcurrent protection, such as a fuse or a current-sensing resistor, to prevent damage from excessive current.
The recommended operating temperature range for the NRVBSS26T3G is -40°C to 150°C. Operating the device outside of this range may affect its performance and reliability.
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NRVBSS26T3G Overview
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