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NRVRGF1J - onsemi

Description: Glass passivated junction. ; For surface mounted application. ; Low forward voltage drop. ; High current capability. ; Easy pick and place. ; High surge current capability.; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; These Devices are Pb−Free and are RoHS Compliant

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NRVRGF1J - onsemi  - 3D model
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NRVRGF1J Details

  • Manufacturer Part Number:

    NRVRGF1J

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Manufacturer Package Code:

    403AE

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2020-08-12

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    1.76 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.25 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

NRVRGF1J Frequently Asked Questions (FAQs)

  • A good thermal design is crucial for the NRVRGF1J. It's recommended to use a 2-layer or 4-layer PCB with a solid ground plane, and to place thermal vias under the device to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and derating guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Always monitor the device's temperature and adjust the design accordingly.
  • Operating the NRVRGF1J at a lower input voltage may reduce the output power and efficiency, while a higher input voltage may increase the risk of overheating and reduce the device's lifespan. It's recommended to operate within the specified input voltage range for optimal performance and reliability.
  • To troubleshoot issues with the NRVRGF1J, start by verifying the input voltage, output load, and PCB layout. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet and application notes for guidance on troubleshooting and debugging.
  • Yes, the NRVRGF1J is a switching regulator, and as such, it can generate electromagnetic interference (EMI). To minimize EMI, follow proper PCB layout and design guidelines, use a shielded enclosure, and consider adding EMI filters or shielding components to the design.

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NRVRGF1J Overview

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