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NRVS1JFL - onsemi

Description: Ultra Thin Profile – Maximum Height of 1.08 mm; UL Flammability 94V-0 Classification; MSL level 1; Green Mold Compound; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free and RoHS Compliant

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PCB Footprints
NRVS1JFL - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SOD−123FL
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NRVS1JFL - onsemi  - 3D model - Diodes Moulded - SOD−123FL
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NRVS1JFL Details

  • Manufacturer Part Number:

    NRVS1JFL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AD

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2019-04-11

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NRVS1JFL Frequently Asked Questions (FAQs)

  • A good PCB layout for the NRVS1JFL should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern around the device. A minimum of 2oz copper thickness is recommended. Additionally, placing the device near a thermal pad or heat sink can improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Proper thermal design, including heat sinking and airflow, can help reduce the junction temperature. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The NRVS1JFL's high current handling requires careful PCB design consideration. Use wide traces (at least 50 mils) for power and ground connections, and ensure that the PCB can handle the high current density. Additionally, consider using multiple vias to connect the device to the power and ground planes to reduce resistance and inductance.
  • The input capacitor selection depends on the specific application requirements, such as the input voltage, current, and frequency. A general guideline is to choose a capacitor with a voltage rating at least 1.5 times the maximum input voltage, and a capacitance value between 10uF to 100uF. The capacitor's ESR (Equivalent Series Resistance) should be low enough to minimize voltage ripple and ensure stable operation.
  • The NRVS1JFL's high-frequency switching can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize these effects, use proper shielding, grounding, and layout techniques, such as separating the device from sensitive analog circuits, using a Faraday shield, and implementing EMI filters or chokes in the input and output lines.

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NRVS1JFL Overview

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