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NRVTS30120MFST3G - onsemi

Description: High current density in SO8-FL (5x6) package; Lower forward voltage drop; Less leakage current; Higher avalanche energy; AEC-Q101 Qaulification

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NRVTS30120MFST3G - onsemi  - 3D model
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NRVTS30120MFST3G Details

  • Manufacturer Part Number:

    NRVTS30120MFST3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    120 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PSSO-N4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    120 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    120 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

NRVTS30120MFST3G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the top and bottom layers, with multiple vias connecting them to dissipate heat efficiently. Additionally, keeping the component away from other heat sources and using a thermal pad or heat sink can further improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and consider derating the device's power handling capabilities. Additionally, using a heat sink or thermal pad, and ensuring good airflow around the device can help maintain a safe operating temperature.
  • The recommended soldering conditions for the NRVTS30120MFST3G are a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C to ensure reliable connections.
  • To handle ESD protection during handling and assembly, it's recommended to follow standard ESD precautions, such as using an ESD wrist strap, ESD mat, or ESD-safe packaging. Additionally, ensuring that the device is stored in its original packaging or an ESD-safe container when not in use can help prevent ESD damage.
  • The recommended storage conditions for the NRVTS30120MFST3G are a temperature range of -40°C to 125°C, with a relative humidity of 60% or less. It's also essential to store the device in its original packaging or an ESD-safe container to prevent damage.

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NRVTS30120MFST3G Overview

Use the download button to access the NRVTS30120MFST3G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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