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NRVUS160VT3G-GA01 - onsemi

Description: Diode 600 V 2A Surface Mount SMB Power Rectifier, Ultra-Fast Recovery, 1 A, 600 V

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NRVUS160VT3G-GA01 - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J_1
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NRVUS160VT3G-GA01 - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J_1
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NRVUS160VT3G-GA01 Details

  • Manufacturer Part Number:

    NRVUS160VT3G-GA01

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

NRVUS160VT3G-GA01 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths. For thermal management, a heat sink or thermal pad is recommended to keep the junction temperature below 125°C.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power-up and power-down sequences, and to use a soft-start circuit to limit the inrush current. Additionally, ensure that the input voltage is within the specified range and that the device is properly bypassed.
  • Operating the device at high temperatures can reduce its reliability and lifespan. High temperatures can also increase the risk of thermal runaway, which can lead to device failure. It's essential to ensure that the device is operated within the recommended temperature range and that adequate thermal management is implemented.
  • To troubleshoot issues with the device, start by verifying that the input voltage and current are within the specified range. Check the PCB layout and thermal management to ensure that they meet the recommended guidelines. Use oscilloscopes and thermal imaging cameras to identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the device is sensitive to electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues. To minimize EMI/EMC issues, use a shielded enclosure, keep the device away from high-frequency sources, and ensure that the PCB layout is designed to minimize radiation. Follow the recommended layout and grounding guidelines to reduce EMI/EMC issues.

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NRVUS160VT3G-GA01 Overview

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