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NSBC143ZDP6T5G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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NSBC143ZDP6T5G - onsemi - PCB symbol
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PCB Footprints
NSBC143ZDP6T5G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT−963 CASE 527AD−01 ISSUE E
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3D Models
NSBC143ZDP6T5G - onsemi - 3D model - SO Transistor Flat Lead - SOT−963 CASE 527AD−01 ISSUE E
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NSBC143ZDP6T5G Details

  • Manufacturer Part Number:

    NSBC143ZDP6T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-963 1x1, 0.35P

  • Pin Count:

    6

  • Manufacturer Package Code:

    527AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO IS 10

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.408 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NSBC143ZDP6T5G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • The NSBC143ZDP6T5G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 2kV HBM and 250V MM protection is recommended.
  • Yes, the NSBC143ZDP6T5G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, additional testing and validation may be required depending on the specific application.
  • The recommended soldering conditions are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 3 reflows. Follow the onsemi recommended soldering profile for optimal results.

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NSBC143ZDP6T5G Overview

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