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NSD350HT1G - onsemi

Description: These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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Symbol
NSD350HT1G - onsemi - PCB symbol
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PCB Footprints
NSD350HT1G - onsemi PCB footprint - Other - Other - SOD−323 CASE 477 STYLE 1
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3D Models
NSD350HT1G - onsemi - 3D model - Other - SOD−323 CASE 477 STYLE 1
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NSD350HT1G Details

  • Manufacturer Part Number:

    NSD350HT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323

  • Package Description:

    SOD-323, 2 PIN

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Application:

    HIGH VOLTAGE

  • Breakdown Voltage-Min:

    350 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Rep Pk Reverse Voltage-Max:

    350 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.055 µs

  • Reverse Test Voltage:

    350 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSD350HT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • Use a human body model (HBM) ESD protection circuit at the input pins, and consider adding a TVS (transient voltage suppressor) diode for additional protection. Follow the onsemi application note for ESD protection guidelines.
  • Yes, the NSD350HT1G is qualified to automotive and industrial standards, making it suitable for high-reliability applications. However, ensure that the device is operated within the recommended specifications and follow the recommended design guidelines.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check the power supply voltage, input signal integrity, and output load conditions. Consult the onsemi application notes and technical support resources for further assistance.

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NSD350HT1G Overview

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