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NSG1001MXTAG - onsemi

Description: Low insertion loss up to 8.5GHz; Capable of 1.6 V Operation

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PCB Footprints
NSG1001MXTAG - onsemi PCB footprint - Other - Other - XDFNW6 1.0x1.0, 0.35P CASE 717AE ISSUE B
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3D Models
NSG1001MXTAG - onsemi  - 3D model - Other - XDFNW6 1.0x1.0, 0.35P CASE 717AE ISSUE B
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NSG1001MXTAG Details

  • Manufacturer Part Number:

    NSG1001MXTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFNW6 1.0x1.0, 0.35P

  • Manufacturer Package Code:

    717AE

  • Factory Lead Time:

    19 Weeks

  • Date Of Intro:

    2020-08-26

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • JESD-609 Code:

    e3

  • RF/Microwave Device Type:

    SPDT

  • Terminal Finish:

    Matte Tin (Sn) - annealed

NSG1001MXTAG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NSG1001MXTAG involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, the NSG1001MXTAG requires a stable voltage supply, typically between 2.7V and 5.5V. The device also requires a bias resistor (RBIAS) connected between the VCC pin and the GND pin, with a recommended value of 1 kΩ to 10 kΩ.
  • The NSG1001MXTAG is designed to operate up to 100 MHz, but the actual operating frequency may be limited by the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information on frequency limitations.
  • The NSG1001MXTAG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, and ESD-safe packaging materials.
  • The NSG1001MXTAG has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved through proper PCB design, thermal vias, and heat sinks, as well as ensuring good airflow around the device.

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NSG1001MXTAG Overview

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