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NSPM2051MUT5G - onsemi

Description: Low Clamping Voltage; 0603 UDFN package 1.6 x 1.0 mm; High Ipp capability

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Symbol
NSPM2051MUT5G - onsemi - PCB symbol
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PCB Footprints
NSPM2051MUT5G - onsemi PCB footprint - Diodes Chip - Diodes Chip - UDFN2 1.6x1.0, 1.1P CASE 517CZ ISSUE B
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3D Models
NSPM2051MUT5G - onsemi - 3D model - Diodes Chip - UDFN2 1.6x1.0, 1.1P CASE 517CZ ISSUE B
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NSPM2051MUT5G Details

  • Manufacturer Part Number:

    NSPM2051MUT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    UDFN-2

  • Package Description:

    UDFN2, 2 PIN

  • Manufacturer Package Code:

    517CZ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    7 V

  • Breakdown Voltage-Min:

    5.1 V

  • Breakdown Voltage-Nom:

    6.05 V

  • Clamping Voltage-Max:

    10.5 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL GOLD PALLADIUM

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSPM2051MUT5G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • A minimum of 10uF ceramic capacitor is recommended between the input pin and ground to ensure stable operation. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Ensure that the device is operated within the recommended voltage and current ratings. Use a voltage regulator or transient voltage suppressor to protect the device from voltage spikes or surges. Also, ensure that the device is not exposed to electrostatic discharge (ESD) or electrical fast transients (EFT).
  • A peak reflow temperature of 260°C is recommended, with a maximum time above 217°C of 30 seconds. The device should be soldered using a no-clean or water-soluble flux, and the soldering process should be completed within 8 hours of opening the package.

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NSPM2051MUT5G Overview

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