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NSPM3041MXT5G - onsemi

Description: Protection for IEC61000−4−2 Level 4: ±30 kV Contact Discharge; Protection for IEC61000−4−5 (Lightning): 40 A (8/20 µs); Small Body Outline: 1.0 mm x 0.6 mm; These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; Low clamping voltage at high Ipp 7.8 V Clamping at 40 A (8/20 µs)

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PCB Footprints
NSPM3041MXT5G - onsemi PCB footprint - Other - Other - X2DFN2 1.0x0.6, 0.65P
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NSPM3041MXT5G - onsemi  - 3D model - Other - X2DFN2 1.0x0.6, 0.65P
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NSPM3041MXT5G Details

  • Manufacturer Part Number:

    NSPM3041MXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X2DFN-2

  • Manufacturer Package Code:

    714AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    7.5 V

  • Breakdown Voltage-Min:

    5.3 V

  • Breakdown Voltage-Nom:

    6.1 V

  • Clamping Voltage-Max:

    8.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    4.5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSPM3041MXT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet. However, it can be estimated by considering the device's voltage, current, and power ratings. Consult with onsemi's application engineers for specific guidance.
  • Yes, the NSPM3041MXT5G is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required for specific use cases.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but additional external protection may be necessary depending on the application.

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