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NSR01F30MXT5G - onsemi

Description: Very Low Forward Voltage Drop - 350 mV @ 10 mA; Low Reverse current - 5 uA @ 10 V; ESD Rating - Human Body Model: Class 3B ESD Rating - Machine Model: Class C; Pb and Halide Free Device; 100 mA of Continuous Forward Current

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NSR01F30MXT5G - onsemi - PCB symbol
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PCB Footprints
NSR01F30MXT5G - onsemi PCB footprint - Diodes Chip Non-polarised - Diodes Chip Non-polarised - NSR01F30MXT5G
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NSR01F30MXT5G - onsemi - 3D model - Diodes Chip Non-polarised - NSR01F30MXT5G
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NSR01F30MXT5G Details

  • Manufacturer Part Number:

    NSR01F30MXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X3DFN2, 0.62x0.32, 0.355P, (0201)

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.18 W

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR01F30MXT5G Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • The device requires a stable input voltage (VIN) and a proper biasing circuit to ensure optimal performance. A voltage regulator or a low-dropout regulator (LDO) can be used to regulate the input voltage. The biasing circuit should be designed to provide a stable voltage reference and a low-impedance output.
  • The NSR01F30MXT5G is rated for operation from -40°C to 150°C (TJ). However, the maximum operating temperature range may vary depending on the specific application and the device's power dissipation.
  • Overvoltage protection (OVP) and overcurrent protection (OCP) circuits can be implemented to protect the device from damage. A zener diode or a transient voltage suppressor (TVS) can be used for OVP, while a current sense resistor and a comparator can be used for OCP.
  • The device should be stored in a dry, cool place, away from direct sunlight and moisture. It should be handled with anti-static precautions, such as using an anti-static wrist strap or mat, to prevent electrostatic discharge (ESD) damage.

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NSR01F30MXT5G Overview

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