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NSR01L30MXT5G - onsemi

Description: Very Low Forward Voltage Drop - 350 mV @ 1 mA; Low Reverse Current - 0.2 uA @ 10 V; 100 mA of Continuous Forward Current; ESD Rating - Human Body Model: Class 3B ESD Rating - Machine Model: Class C; Pb and Halide Free Device

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NSR01L30MXT5G - onsemi PCB footprint - Other - Other - NSR01L30NXT5G-1
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NSR01L30MXT5G - onsemi  - 3D model - Other - NSR01L30NXT5G-1
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NSR01L30MXT5G Details

  • Manufacturer Part Number:

    NSR01L30MXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X3DFN-2

  • Package Description:

    X3DFN2, 2 PIN

  • Manufacturer Package Code:

    152AF

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    4.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.35 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.18 W

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR01L30MXT5G Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. Ensure a minimum of 2 oz copper thickness and a thermal via array under the device to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage transient on the input pins is ±500 mV, with a duration of less than 100 ns. Exceeding this may cause device damage or malfunction.
  • Yes, the NSR01L30MXT5G is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended design and manufacturing guidelines to meet the required reliability standards.
  • Follow proper ESD handling procedures, use an ESD wrist strap or mat, and ensure all equipment is grounded. Avoid touching the device pins or handling the device by the leads.

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NSR01L30MXT5G Overview

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