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NSR01L30NXT5G - onsemi

Description: Diode 30 V 100mA Surface Mount 2-DSN (0.60x0.30)

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PCB Footprints
NSR01L30NXT5G - onsemi PCB footprint - Other - Other - DSN2, 0.6x0.3, 0.4P, (0201) CASE 152AA ISSUE B_2025
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3D Models
NSR01L30NXT5G - onsemi  - 3D model - Other - DSN2, 0.6x0.3, 0.4P, (0201) CASE 152AA ISSUE B_2025
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NSR01L30NXT5G Details

  • Manufacturer Part Number:

    NSR01L30NXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DSN2, 0.6x0.3, 0.4P, (0201)

  • Package Description:

    DSN-2

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    4.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.4 V

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.735 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR01L30NXT5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the NSR01L30NXT5G, the SOA is limited by the maximum voltage rating of 30V and the maximum current rating of 1A.
  • Use proper ESD handling procedures, such as grounding yourself and using an ESD wrist strap. Also, ensure that the device is stored in an ESD-safe environment and handled with ESD-safe materials.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds is recommended. Ensure that the device is not exposed to temperatures above 260°C for an extended period.

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NSR01L30NXT5G Overview

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