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NSR05301MX4T5G - onsemi

Description: Smallest Package Available (01005); 0.445mm x 0.24mm; 500 mA of Continuous Forward Current; Low Forward Voltage Drop, VF = 430 mV (Typical) @ IF = 200 mA; Low Reverse Current, 25 µA (Typical) @ VR = 30 V; Low trr = 9 ns Typical; Low Capacitance, 19 pF (Typical)

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NSR05301MX4T5G - onsemi PCB footprint - Other - Other - NSR05301MX4T5G-4
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NSR05301MX4T5G Details

  • Manufacturer Part Number:

    NSR05301MX4T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    X4DFN-2

  • Package Description:

    X4DFN2, 2 PIN

  • Manufacturer Package Code:

    718AA

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Date Of Intro:

    2018-07-18

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.8 V

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.203 W

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.011 µs

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN COPPER SILVER

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR05301MX4T5G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. A thermal pad on the bottom of the device should be connected to a thermal plane on the PCB.
  • Use a shielded enclosure, ensure proper grounding, and follow PCB layout guidelines for minimizing EMI. Additionally, use a common-mode choke or ferrite bead on the input lines to reduce EMI.
  • The MTBF (Mean Time Between Failures) for NSR05301MX4T5G is typically >100 million hours, and the FIT (Failure In Time) rate is <10. Refer to the onsemi reliability report for more information.
  • Use a reflow soldering process with a peak temperature of 260°C. Ensure the device is handled by trained personnel, and follow the recommended storage and handling procedures to prevent damage.
  • The NSR05301MX4T5G is RoHS and REACH compliant, and meets the requirements of EU Directive 2011/65/EU and (EC) No 1907/2006. Refer to the onsemi website for the latest certifications and compliance information.

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NSR05301MX4T5G Overview

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