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NSR05402NXT5G - onsemi

Description: Low Forward Voltage Drop - 570 mV (Typ.) @ IF = 500 mA; Low Reverse Current - 3.0 µA (Typ.) @ VR = 40 V; ESD Rating − Human Body Model: Class 3B ; Machine Model: Class C; High Switching Speed; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NSR05402NXT5G - onsemi PCB footprint - Diodes Chip - Diodes Chip - DSN2, 0.6x0.3, 0.4P, (0201)
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3D Models
NSR05402NXT5G - onsemi  - 3D model - Diodes Chip - DSN2, 0.6x0.3, 0.4P, (0201)
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NSR05402NXT5G Details

  • Manufacturer Part Number:

    NSR05402NXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DSN-2

  • Manufacturer Package Code:

    152AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.62 V

  • JESD-30 Code:

    R-PBCC-N2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    8 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.38 W

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    20 µA

  • Reverse Recovery Time-Max:

    0.0059 µs

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR05402NXT5G Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near the edge of the board to minimize thermal resistance. A thermal pad on the bottom of the device should be connected to a thermal relief pattern on the PCB. Additionally, using a heat sink or thermal interface material can help to further reduce thermal resistance.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, the device should be soldered correctly, and the PCB should be designed to minimize thermal stress. It's also recommended to perform thorough testing and validation over the full temperature range.
  • The NSR05402NXT5G has built-in ESD protection diodes on all pins, which can withstand up to 2 kV of ESD voltage. To prevent latch-up, it's recommended to follow proper PCB design and layout guidelines, including using a solid ground plane and minimizing signal trace lengths. Additionally, using a latch-up prevention diode or a series resistor on the input pins can provide extra protection.
  • To minimize power consumption, it's recommended to use the device's built-in power-saving features, such as the shutdown mode. Additionally, optimizing the PCB design to minimize parasitic capacitance and using a low-power mode can help reduce standby current. It's also essential to follow proper voltage and current rating guidelines.
  • The recommended test and measurement methods include using a curve tracer or a semiconductor parameter analyzer to characterize the device's electrical performance. Additionally, using a thermal camera or an infrared thermometer can help measure the device's thermal performance. It's also recommended to follow the manufacturer's recommended test procedures and guidelines.

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NSR05402NXT5G Overview

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