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NSR05F20NXT5G - onsemi

Description: Very Low Forward Drop (VF); Low Reverse Current (IR)

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Symbol
NSR05F20NXT5G - onsemi - PCB symbol
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PCB Footprints
NSR05F20NXT5G - onsemi PCB footprint - Other - Other - DSN2, 1.0x0.6, 0.575P, (0402)
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3D Models
NSR05F20NXT5G - onsemi - 3D model - Other - DSN2, 1.0x0.6, 0.575P, (0402)
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NSR05F20NXT5G Details

  • Manufacturer Part Number:

    NSR05F20NXT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DSN2 1x0.6, 0.575P (0402)

  • Pin Count:

    2

  • Manufacturer Package Code:

    152AC

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.43 V

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.3 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSR05F20NXT5G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NSR05F20NXT5G is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines, use a suitable thermal management system, and ensure the device is operated within the specified maximum junction temperature (Tj).
  • The recommended PCB layout and thermal design for the NSR05F20NXT5G involves using a multi-layer PCB with a thermal pad, ensuring good thermal conductivity, and using thermal vias to dissipate heat efficiently.
  • To handle ESD protection, it's recommended to follow the onsemi application note for ESD protection, use ESD-sensitive handling procedures, and implement ESD protection circuits in the system design.
  • The recommended soldering and assembly guidelines for the NSR05F20NXT5G involve following the onsemi soldering and assembly guidelines, using a suitable soldering profile, and ensuring the device is handled and stored properly.

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NSR05F20NXT5G Overview

Use the download button to access the NSR05F20NXT5G schematic symbol, PCB footprint, and 3D model.
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