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NSR1030QMUTAG - onsemi

Description: Diode Schottky 30V 1A 25ns UDFN4 ON Semi NSR1030QMUTAG, Quad SMT Schottky Diode, 30V 1A, 25ns, 4-Pin UDFN

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PCB Footprints
NSR1030QMUTAG - onsemi PCB footprint - Other - Other - UDFN4 3.0x3.0, 1.30P CASE 517DB ISSUE A
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3D Models
NSR1030QMUTAG - onsemi  - 3D model - Other - UDFN4 3.0x3.0, 1.30P CASE 517DB ISSUE A
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NSR1030QMUTAG Details

  • Manufacturer Part Number:

    NSR1030QMUTAG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    UDFN-4

  • Manufacturer Package Code:

    517DB

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    30 V

  • Case Connection:

    CATHODE

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    S-PDSO-N4

  • Non-rep Pk Forward Current-Max:

    12 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    1.8 W

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    20 µA

  • Reverse Recovery Time-Max:

    0.025 µs

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

NSR1030QMUTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor for temperature monitoring.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage.
  • Consult the application note and reference design for guidance on optimizing the device's performance. Consider factors such as input voltage, output current, and thermal management.
  • Follow the recommended soldering profile and assembly guidelines outlined in the datasheet and application note. Ensure proper handling and storage to prevent damage.

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NSR1030QMUTAG Overview

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