NSS1C301ET4G footprint, schematic symbol and 3D model by onsemi

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NSS1C301ET4G - onsemi PCB footprint - Other - Other - DPAK CASE 369C_5

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Part Number NSS1C301ET4G
Manufacturer onsemi
Pin Count 3
Part Category Transistor BJT NPN
Package Category Other
Footprint Name Other - DPAK CASE 369C_5
Released Date Jun 1, 2021
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

NSS1C301ET4G Details

Manufacturer Part Number:
NSS1C301ET4G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
DPAK (SINGLE GAUGE) TO-252
Package Description:
DPAK-3
Pin Count:
3
Manufacturer Package Code:
369C
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
8 Weeks
Manufacturer:
onsemi
YTEOL:
4
Case Connection:
COLLECTOR
Collector Current-Max (IC):
3 A
Collector-Emitter Voltage-Max:
100 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
80
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
33 W
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
120 MHz

NSS1C301ET4G Frequently Asked Questions (FAQs)

A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
A ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
Use a shielded enclosure or a metal can package to minimize EMI. Ensure that the device is placed away from noise sources and that the PCB layout is designed to minimize radiation. Use a common-mode choke or ferrite bead to filter out high-frequency noise.
A ceramic capacitor with a value of 10uF to 22uF is recommended for output filtering. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.

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