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NSS20501UW3T2G - onsemi

Description: High Current, Low VCE(sat), ESD Robust, High Current Gain, High Cut Off Frequency, Low Profile Package, Linear Gain (Beta)

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PCB Footprints
NSS20501UW3T2G - onsemi PCB footprint - Other - Other - WDFN3 2x2, 1.3P CASE 506AU ISSUE A
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3D Models
NSS20501UW3T2G - onsemi  - 3D model - Other - WDFN3 2x2, 1.3P CASE 506AU ISSUE A
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NSS20501UW3T2G Details

  • Manufacturer Part Number:

    NSS20501UW3T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3 Lead WDFN, 2 x 2 x 0.75 mm, 1.3 mm Pitch

  • Pin Count:

    3

  • Manufacturer Package Code:

    506AU

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

NSS20501UW3T2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and follow proper handling and storage procedures to prevent ESD damage.
  • Power up the device in the following sequence: VCC, then VIN, and finally the input signals. This ensures proper initialization and prevents latch-up or damage.

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NSS20501UW3T2G Overview

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