Description:High Current, Low VCEsat, ESD Robust, High Current Gain, High Cut Off Frequency, Low Profile Package, Linear Gain (Beta); Load Switching, Battery Charging, External Pass Transistor, DC/DC Converter, Complimentary Driver, Current Extention & Low Drop Out Regulation, Cathode Florescent Lamp drive, Peripheral Driver - LEDs, Motors, Relays
ROHS COMPLIANT, MINIATURE, CASE 318F-05, SC-74, 6PIN
Pin Count:
6
Manufacturer Package Code:
318F-05
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Manufacturer:
onsemi
YTEOL:
0
Collector Current-Max (IC):
0.7 A
Collector-Emitter Voltage-Max:
30 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
150
JESD-30 Code:
R-PDSO-G6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
6
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
0.665 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
NSS30071MR6T1G Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other side of the board. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, ensure proper thermal design, including heat sinking and airflow, to keep the device within the specified temperature range.
The NSS30071MR6T1G has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging. Avoid touching the device pins or handling them in a way that could generate static electricity.
The NSS30071MR6T1G is rated for operation in a humidity range of 5% to 95% relative humidity, non-condensing. However, it's essential to follow proper packaging and sealing guidelines to prevent moisture ingress. If the device will be exposed to high humidity or moisture, consider using a conformal coating or potting compound to protect it.
The recommended soldering conditions for the NSS30071MR6T1G include a peak temperature of 260°C, with a soldering time of 10 seconds or less. For rework, use a soldering iron with a temperature of 350°C or less, and avoid applying excessive heat or force, which can damage the device.
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NSS30071MR6T1G Overview
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