Description:NSS40301MZ4 is NPN complimentary device; Low Collector-Emitter Saturation Voltage; High DC Current Gain; High Current-Gain Bandwidth Product; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant
HALOGEN FREE AND ROHS COMPLIANT, CASE 318E-04, TO-261, 4 PIN
Pin Count:
4
Manufacturer Package Code:
0.0318
Country Of Origin:
Malaysia
ECCN Code:
EAR99
Factory Lead Time:
8 Weeks
Manufacturer:
onsemi
YTEOL:
7
Case Connection:
COLLECTOR
Collector Current-Max (IC):
3 A
Collector-Emitter Voltage-Max:
40 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
100
JEDEC-95 Code:
TO-261AA
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
4
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
PNP
Power Dissipation-Max (Abs):
2 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
160 MHz
NSS40300MZ4T3G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using thermal interface materials and ensure that the PCB is designed to handle high temperatures.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
To handle ESD protection for the NSS40300MZ4T3G, it's recommended to follow proper ESD handling procedures during assembly and storage. Additionally, consider using ESD protection devices, such as TVS diodes, and ensure that the PCB design includes ESD protection features, such as ESD diodes and resistors.
The recommended soldering conditions for the NSS40300MZ4T3G involve using a soldering temperature between 240°C to 260°C, with a peak temperature not exceeding 260°C. The soldering time should be limited to 10 seconds or less, and the device should be handled with care to avoid mechanical stress.
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System Verified
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NSS40300MZ4T3G Overview
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