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NSS40600CF8T1G - onsemi

Description: High Current, Low VCEsat, ESD Robust, High Current Gain, High Cut Off Frequency, Low Profile Package, Linear Gain (Beta); S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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PCB Footprints
NSS40600CF8T1G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - ChipFET CASE1206A−03 ISSUE K
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3D Models
NSS40600CF8T1G - onsemi  - 3D model - SO Transistor Flat Lead - ChipFET CASE1206A−03 ISSUE K
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NSS40600CF8T1G Details

  • Manufacturer Part Number:

    NSS40600CF8T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ChipFET

  • Package Description:

    CHIPFET-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    1206A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    6 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    150

  • JESD-30 Code:

    R-PDSO-C8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    2.75 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • Turn-off Time-Max (toff):

    890 ns

  • Turn-on Time-Max (ton):

    340 ns

NSS40600CF8T1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal design, and consider derating the device's power dissipation. Additionally, ensure that the device is soldered correctly, and the PCB is designed to minimize thermal resistance.
  • To prevent ESD damage, it's recommended to use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins. Additionally, follow proper handling and storage procedures, and use an ESD-protected workstation during assembly and testing.
  • The NSS40600CF8T1G is not hermetically sealed, so it's not recommended for use in high-humidity environments. If operation in humid environments is necessary, consider using a conformal coating or potting the device to protect it from moisture.
  • The recommended soldering conditions for the NSS40600CF8T1G include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that prevents thermal shock. Follow the recommended soldering profile and use a solder with a melting point above 217°C.

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NSS40600CF8T1G Overview

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