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NSV40301MZ4T1G - onsemi

Description: NSS40300MZ4 is PNP complimentary device; Low Collector-Emitter Saturation Voltage; High DC Current Gain; High Current-Gain Bandwidth Product; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NSV40301MZ4T1G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT−223 (TO−261) CASE 318E−04 ISSUE R
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3D Models
NSV40301MZ4T1G - onsemi  - 3D model - SOT223 (3-Pin) - SOT−223 (TO−261) CASE 318E−04 ISSUE R
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NSV40301MZ4T1G Details

  • Manufacturer Part Number:

    NSV40301MZ4T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223 (TO-261) 4 LEAD

  • Pin Count:

    4

  • Manufacturer Package Code:

    0.0318

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Collector Current-Max (IC):

    3 A

  • Collector-Emitter Voltage-Max:

    40 V

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

NSV40301MZ4T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation. Additionally, ensure that the PCB is designed to withstand the high temperatures and that the components are selected with a suitable temperature rating.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits on the PCB, such as TVS diodes or ESD protection arrays.
  • The NSV40301MZ4T1G is an automotive-grade device, and it's suitable for use in high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application.
  • The recommended soldering and assembly procedures for the NSV40301MZ4T1G involve following the JEDEC J-STD-020 standard for reflow soldering, using a solder paste with a melting point above 217°C, and ensuring that the PCB is designed to withstand the soldering temperatures.

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NSV40301MZ4T1G Overview

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