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NSV50010YT1G - onsemi

Description: Robust Power Package: 460 mW, Wide operating voltage range, Immediate turn on, Voltage surge suppressing protecting LEDs, UL94-V0 certified, SBT (Self Biased Transistor) Technology, Negative Temperature Coefficient, This device is PB-Free, Halogen Free/BFR Free and is RoHS Compliant; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable

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NSV50010YT1G - onsemi - PCB symbol
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NSV50010YT1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - NSV50010YT1G
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NSV50010YT1G - onsemi - 3D model - Small Outline Diode - NSV50010YT1G
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NSV50010YT1G Details

  • Manufacturer Part Number:

    NSV50010YT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Package Description:

    SOD-123, 2 PIN

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.89

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Length:

    2.69 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q101

  • Seated Height-Max:

    1.35 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

NSV50010YT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal shocks or rapid temperature changes.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Ensure that the device is operated within the recommended voltage range (Vin = 4.5V to 18V). Use a voltage regulator or transient voltage suppressor to protect against voltage spikes and surges. Also, ensure that the device is not exposed to electrostatic discharge (ESD).
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for output filtering. The capacitor should be placed as close to the output pin as possible to minimize parasitic inductance.

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NSV50010YT1G Overview

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