Part Image

NSVBAS70LT1G - onsemi

Description: Extremely Fast Switching Speed; Low Forward Voltage 0.75 Volts (Typ) @ IF = 10 mAdc; Pb-Free Package is Available; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

Download NSVBAS70LT1G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
NSVBAS70LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - NSVBAS70LT1G
click to zoom
3D Models
NSVBAS70LT1G - onsemi  - 3D model - SOT23 (3-Pin) - NSVBAS70LT1G
click to zoom

NSVBAS70LT1G Details

  • Manufacturer Part Number:

    NSVBAS70LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, CASE 318 -08, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.41 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.07 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVBAS70LT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Ensure the device is handled in accordance with the JEDEC J-STD-020 standard.
  • Handle the device in an ESD-controlled environment, using wrist straps, anti-static bags, and ESD-safe workstations. Ensure all equipment and tools are properly grounded.
  • Use a high-quality, low-ESR ceramic capacitor (e.g., X7R or X5R) with a value of 10-22 μF, depending on the specific application requirements.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NSVBAS70LT1G Overview

Use the download button to access the NSVBAS70LT1G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NSVBA, or try a keyword search, such as Rectifier Diodes

Parts related to NSVBAS70LT1G

Showing 0 results