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NSVBC847BDW1T2G - onsemi

Description: Device Marking: BC846BDW1T1 = 1B BC847BDW1T1 = 1F BC847CDW1T1 = 1G BC848BDW1T1 = 1K BC848CDW1T1 = 1L; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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PCB Footprints
NSVBC847BDW1T2G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT−363-6
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3D Models
NSVBC847BDW1T2G - onsemi  - 3D model - SOT23 (6-Pin) - SOT−363-6
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NSVBC847BDW1T2G Details

  • Manufacturer Part Number:

    NSVBC847BDW1T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.38 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

NSVBC847BDW1T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper PCB design guidelines.
  • The recommended soldering conditions for the NSVBC847BDW1T2G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering temperature profile that follows the JEDEC J-STD-020 standard.
  • To handle ESD protection during handling and assembly, it's recommended to follow proper ESD handling procedures, use ESD-protective packaging and materials, and ensure that all personnel handling the devices are grounded. Additionally, consider using ESD-protective devices and circuits in the design.
  • The recommended storage and handling conditions for the NSVBC847BDW1T2G are: storage temperature range of -40°C to 125°C, relative humidity of 60% or less, and protection from direct sunlight and moisture.

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NSVBC847BDW1T2G Overview

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