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NSVBCP69T1G - onsemi

Description: NPN Complement is BCP68; SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.; High Current: IC = -1.0 Amp; Available in 12 mm Tape and Reel Use BCP69T1 to order the 7 inch/1000 unit reel. Use BCP69T3 to order the 13 inch/4000 unit reel.; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Chang

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Symbol
NSVBCP69T1G - onsemi - PCB symbol
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PCB Footprints
NSVBCP69T1G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223 -2020
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3D Models
NSVBCP69T1G - onsemi - 3D model - SOT223 (3-Pin) - SOT-223 -2020
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NSVBCP69T1G Details

  • Manufacturer Part Number:

    NSVBCP69T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223 (TO-261) 4 LEAD

  • Pin Count:

    4

  • Manufacturer Package Code:

    0.0318

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Collector Current-Max (IC):

    1 A

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    85

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    1.5 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVBCP69T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND8325/D for more details.
  • Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
  • Follow the ESD handling precautions outlined in the onsemi ESD Protection Application Note (AND8326/D). Use an ESD wrist strap or mat, and handle the device by the body or leads, not the die.
  • Yes, the NSVBCP69T1G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards, such as AEC-Q100 or ISO 26262.
  • Consult the onsemi troubleshooting guide (AND8327/D) for common issues and solutions. If the issue persists, contact onsemi's technical support for further assistance.

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