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NSVC2030JBT3G - onsemi

Description: UL94−V0 Certified; Wide Operating Voltage Range; Immediate Turn-On; Voltage Surge Suppressing; SBT (Self-Biased Transistor) Technology; Negative Temperature Coefficient; Also available in 20 mA (NSIC2020JBT3G) and 50 mA (NSIC2050JBT3G); NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Robust Power Package: 3 W

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NSVC2030JBT3G - onsemi - PCB symbol
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PCB Footprints
NSVC2030JBT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - .SMB CASE 403A−03 ISSUE J
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NSVC2030JBT3G - onsemi - 3D model - Diodes Moulded - .SMB CASE 403A−03 ISSUE J
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NSVC2030JBT3G Details

  • Manufacturer Part Number:

    NSVC2030JBT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB-2

  • Package Description:

    SMB-2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.89

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Length:

    4.32 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    6

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q101

  • Seated Height-Max:

    2.47 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.56 mm

NSVC2030JBT3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • The NSVC2030JBT3G has internal ESD protection, but it's still recommended to follow standard ESD handling precautions when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
  • Yes, the NSVC2030JBT3G is qualified for automotive and high-reliability applications. However, it's essential to review the device's AEC-Q100 qualification and PPAP (Production Part Approval Process) documentation to ensure it meets the specific requirements of your application.
  • Start by reviewing the datasheet and application notes to ensure proper usage and configuration. Use oscilloscopes or logic analyzers to debug the device's behavior. If issues persist, contact onsemi's technical support for further assistance.

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NSVC2030JBT3G Overview

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