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NSVC2050JBT3G - onsemi

Description: NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Robust Power Package: 3 W; Wide Operating Voltage Range; Immediate Turn-On; Voltage Surge Suppressing; SBT (Self-Biased Transistor) Technology; Negative Temperature Coefficient; Also available in 20 mA (NSIC2020JBT3G) and 30 mA (NSIC2030JBT3G); UL94−V0 Certified

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NSVC2050JBT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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NSVC2050JBT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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NSVC2050JBT3G Details

  • Manufacturer Part Number:

    NSVC2050JBT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB-2

  • Package Description:

    SMB-2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.89

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Length:

    4.32 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.47 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.56 mm

NSVC2050JBT3G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet. However, it can be estimated by considering the device's thermal resistance, maximum junction temperature, and power handling. Consult with onsemi's application engineers for guidance.
  • Yes, the NSVC2050JBT3G is suitable for switching regulator applications. However, ensure that the device is properly biased, and the switching frequency is within the recommended range.
  • Use proper ESD handling procedures during assembly and storage. Implement ESD protection circuits, such as TVS diodes or ESD protection arrays, in the system design.

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NSVC2050JBT3G Overview

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