Description:Low-noise : NF = 1.0 dB typ. (f = 1 GHz); High gain : |S21e|2 = 12 dB typ. (f = 1 GHz); High cut-off frequency : fT = 7 GHz typ.; SSFP package is pin-compatible with SOT-623; AEC-Q101 qualified and PPAP capable; Pb-Free, Halogen Free and RoHS compliance
Mainland China, Malaysia, Philippines, Thailand, Vietnam
ECCN Code:
EAR99
HTS Code:
8541.21.00.75
Factory Lead Time:
31 Weeks
Manufacturer:
onsemi
YTEOL:
0
Collector Current-Max (IC):
0.07 A
Collector-Base Capacitance-Max:
1.2 pF
Collector-Emitter Voltage-Max:
10 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
90
Highest Frequency Band:
ULTRA HIGH FREQUENCY BAND
JESD-30 Code:
R-PDSO-F3
JESD-609 Code:
e6
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation Ambient-Max:
0.1 W
Power Dissipation-Max (Abs):
0.1 W
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
Tin/Bismuth (Sn/Bi)
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
AMPLIFIER
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
7000 MHz
NSVF5488SKT3G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using a thermal interface material to fill any gaps.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
To handle ESD protection for the NSVF5488SKT3G, follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design. Additionally, consider using ESD-protected devices and components in the surrounding circuitry.
The recommended soldering conditions for the NSVF5488SKT3G involve using a soldering temperature between 240°C to 260°C, with a peak temperature not exceeding 260°C. The soldering time should be limited to 10 seconds or less, and the device should be handled with care to avoid mechanical stress.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NSVF5488SKT3G Overview
Use the download button to access the NSVF5488SKT3G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NSVF5,
or try a keyword search, such as RF Small Signal Bipolar Transistors
