Mainland China, Malaysia, Philippines, Thailand, Vietnam
ECCN Code:
EAR99
HTS Code:
8541.21.00.75
Factory Lead Time:
8 Weeks
Manufacturer:
onsemi
YTEOL:
0
Collector Current-Max (IC):
0.07 A
Collector-Base Capacitance-Max:
1.2 pF
Collector-Emitter Voltage-Max:
10 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
100
Highest Frequency Band:
ULTRA HIGH FREQUENCY BAND
JESD-30 Code:
R-PDSO-F3
JESD-609 Code:
e6
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation Ambient-Max:
0.25 W
Power Dissipation-Max (Abs):
0.25 W
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
Tin/Bismuth (Sn/Bi)
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
AMPLIFIER
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
5500 MHz
NSVF5501SKT3G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a heat sink or a thermal management system.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and use a thermal management system. Additionally, consider using a thermistor or a temperature sensor to monitor the device temperature and implement thermal protection mechanisms.
The NSVF5501SKT3G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
Yes, the NSVF5501SKT3G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application. Consult with onsemi's application engineers for guidance on using this device in high-reliability or automotive applications.
Follow standard soldering and assembly techniques for surface-mount devices. Use a soldering iron with a temperature range of 220°C to 240°C, and ensure that the soldering time is within 3 seconds to 5 seconds. Use a solder paste with a melting point of 217°C to 220°C, and follow the recommended reflow profile.
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Manufacturer Collaborated
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System Verified
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NSVF5501SKT3G Overview
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