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NSVMMBD352WT1G - onsemi

Description: Low Forward Voltage - 0.5 Volts (Typ) @ IF = 10 mA; Very Low Capacitance - Less Than 1.0 pF @ Zero Volts; Pb-Free Package is Available; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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Symbol
NSVMMBD352WT1G - onsemi - PCB symbol
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PCB Footprints
NSVMMBD352WT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC−70 (SOT−323)
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3D Models
NSVMMBD352WT1G - onsemi - 3D model - SOT23 (3-Pin) - SC−70 (SOT−323)
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NSVMMBD352WT1G Details

  • Manufacturer Part Number:

    NSVMMBD352WT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVMMBD352WT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering.
  • Implement EOS protection circuits, such as TVS diodes or zener diodes, to protect against voltage transients and surges. Ensure proper PCB layout and component selection.
  • Store the device in its original packaging, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or die. Use an anti-static wrist strap or mat when handling the device.

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NSVMMBD352WT1G Overview

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