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NSVMMUN2131LT1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
NSVMMUN2131LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR_2
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3D Models
NSVMMUN2131LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR_2
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NSVMMUN2131LT1G Details

  • Manufacturer Part Number:

    NSVMMUN2131LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, 318-08, TO-236, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    8

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NSVMMUN2131LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep the device away from heat sources. A heat sink or thermal pad can be used to improve heat dissipation. Consult onsemi's application notes and thermal management guidelines for more information.
  • Choose an input capacitor with a low ESR, high ripple current rating, and a voltage rating that matches the input voltage. A ceramic capacitor with an X7R or X5R dielectric is recommended. Consult the datasheet for specific recommendations and onsemi's capacitor selection guide.
  • The maximum allowed voltage deviation on the input pin is typically ±10% of the nominal input voltage. However, it's recommended to consult the datasheet and onsemi's application notes for specific guidance on input voltage tolerance.
  • Follow onsemi's EMC guidelines, use a shielded layout, and add filtering components (e.g., ferrite beads, chokes) to minimize electromagnetic interference. Ensure the device is placed away from noise sources and sensitive components.
  • The recommended operating temperature range for the NSVMMUN2131LT1G is -40°C to 150°C. However, the device can operate up to 175°C with derating. Consult the datasheet for specific temperature-related information.

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