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NSVP249SDSF3T1G - onsemi

Description: AEC-Q101 qualified and PPAP capable; Series connection of 2 elements in a small-size package; Small Interterminal Capacitance (C = 0.23 pF typ); Small Forward Series Resistance (rs = 4.5 Ω max); Pb-Free, Halogen Free and RoHS Compliance; MCP3 package is pin-compatible with SC-70

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NSVP249SDSF3T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC−70 / MCP3 CASE 419AJ ISSUE O
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NSVP249SDSF3T1G - onsemi  - 3D model - SOT23 (3-Pin) - SC−70 / MCP3 CASE 419AJ ISSUE O
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NSVP249SDSF3T1G Details

  • Manufacturer Part Number:

    NSVP249SDSF3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 / MCP3

  • Package Description:

    SC-70, 3 PIN

  • Manufacturer Package Code:

    419AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.4

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    0.23 pF

  • Diode Capacitance-Nom:

    0.23 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    4.5 Ω

  • Diode Res Test Current:

    10 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • Frequency Band:

    VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.1 W

  • Reference Standard:

    AEC-Q101

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVP249SDSF3T1G Frequently Asked Questions (FAQs)

  • The recommended gate resistor value is typically between 10 Ω to 20 Ω, depending on the specific application and switching frequency.
  • Proper thermal management involves using a heat sink with a thermal resistance of ≤ 0.5°C/W, applying a thermal interface material, and ensuring good airflow around the device.
  • The maximum allowed voltage imbalance is typically ±10% of the nominal DC link voltage to ensure proper operation and prevent overvoltage stress.
  • Yes, but it's essential to ensure that the devices are matched in terms of threshold voltage and current gain to prevent uneven current sharing and potential damage.
  • The recommended dead-time setting is typically between 1 μs to 3 μs, depending on the specific application and switching frequency.

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