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NSVR0240V2T1G - onsemi

Description: Very Low Forward Voltage Drop - 480 mV @ 100 mA; Low Reverse Current - 0.2 uA @ 25 V VR; 250 mA of Continuous Forward Current; Power Dissipation of 200 mW with Minimum Trace; Very High Switching Speed; Low Capacitance - CT = 4 pF; This is a Pb-Free Device; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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PCB Footprints
NSVR0240V2T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−523
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3D Models
NSVR0240V2T1G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD−523
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NSVR0240V2T1G Details

  • Manufacturer Part Number:

    NSVR0240V2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523 2 LEAD

  • Package Description:

    CASE 502-01, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.003 µs

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVR0240V2T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND9173/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Monitor the device's junction temperature (TJ) and adjust the operating conditions accordingly.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input/output pins to protect against electrostatic discharge. Follow the onsemi application note AND8033/D for ESD protection guidelines.
  • Ensure that the power supplies are sequenced correctly to prevent damage to the device. The recommended power-up sequence is VCC, then VIN. The power-down sequence should be reversed. Refer to the datasheet for more details.
  • Use a soldering temperature of 260°C (max) for a maximum of 10 seconds. Avoid using soldering temperatures above 280°C, as this can damage the device. Refer to the onsemi application note AND8003/D for more details.

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