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NSVR02HL40MX2WT5G - onsemi

Description: Diode 40 V 200mA Surface Mount, Wettable Flank 2-X2DFNW (1x0.6)

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NSVR02HL40MX2WT5G - onsemi PCB footprint - Other - Other - X2DFNW-2 1.00x0.60x0.37, 0.65P CASE 711BG ISSUE F
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3D Models
NSVR02HL40MX2WT5G - onsemi  - 3D model - Other - X2DFNW-2 1.00x0.60x0.37, 0.65P CASE 711BG ISSUE F
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NSVR02HL40MX2WT5G Details

  • Manufacturer Part Number:

    NSVR02HL40MX2WT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFNW2

  • Package Description:

    X2DFNW2, 2 PIN

  • Manufacturer Package Code:

    711BG

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    500 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVR02HL40MX2WT5G Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the device near the power source, using a solid ground plane, and minimizing trace lengths. For thermal management, a heat sink or thermal pad is recommended to keep the junction temperature below 150°C. Consult onsemi's application notes and thermal management guidelines for more information.
  • To ensure EMC, follow onsemi's guidelines for PCB layout, component placement, and shielding. Use a metal shield or a Faraday cage to enclose the device, and ensure proper grounding and decoupling. Additionally, consider using EMI filters or common-mode chokes to reduce electromagnetic interference.
  • onsemi provides reliability data, such as FIT (failures in time) rates, MTBF (mean time between failures), and MTTR (mean time to repair), in their reliability reports. The device is also qualified according to industry standards, such as AEC-Q101, and undergoes rigorous testing and inspection to ensure high quality and reliability.
  • The NSVR02HL40MX2WT5G is rated for operation up to 150°C junction temperature. However, for high-temperature environments, consider using a heat sink or thermal pad to maintain a safe operating temperature. Consult onsemi's thermal management guidelines and application notes for more information.
  • For troubleshooting, consult onsemi's application notes, datasheet, and troubleshooting guides. Common issues include overheating, incorrect PCB layout, or inadequate power supply. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the root cause of the issue.

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