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NSVRB751V40T1G - onsemi

Description: Extremely Fast Switching Speed; Extremely Low Forward Voltage -0.28 Volts (Typ) @ IF = 1 mAdc; Low Reverse Current

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PCB Footprints
NSVRB751V40T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323 - case 477-02 - issue H
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NSVRB751V40T1G - onsemi  - 3D model - Small Outline Diode - SOD-323 - case 477-02 - issue H
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NSVRB751V40T1G Details

  • Manufacturer Part Number:

    NSVRB751V40T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.37 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.03 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NSVRB751V40T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Avoid wave soldering or hand soldering, as it may damage the device.
  • Use an ESD-protected workstation, wear an ESD strap, and handle the device by the body or pins to prevent electrostatic discharge. Use ESD-sensitive packaging and storage materials.
  • Store the device in a dry, cool place (−40°C to 30°C) with relative humidity below 60%. Avoid exposure to direct sunlight, moisture, or contaminants.

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NSVRB751V40T1G Overview

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