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NSVS50030SB3T1G - onsemi

Description: Large Current Capacitance; Low Collector to Emitter Saturation Voltage; High-Speed Switching; High Allowable Power Dissipation; AEC-Q101qualified and PPAP capable; Ultra small package facilitates miniaturization in end products (mounting height : 0.9 mm)

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NSVS50030SB3T1G - onsemi - PCB symbol
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PCB Footprints
NSVS50030SB3T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - CPH3
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3D Models
NSVS50030SB3T1G - onsemi - 3D model - SOT23 (3-Pin) - CPH3
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NSVS50030SB3T1G Details

  • Manufacturer Part Number:

    NSVS50030SB3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CPH-3

  • Manufacturer Package Code:

    318BA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2018-07-23

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Collector Current-Max (IC):

    3 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    1.1 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    360 MHz

  • VCEsat-Max:

    0.5 V

NSVS50030SB3T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 150°C). Use a heat sink or thermal pad to maintain a safe junction temperature (Tj). Monitor the device's thermal resistance (RθJA) and ensure it is within the specified range.
  • Use a soldering temperature of 260°C (max) with a dwell time of 10 seconds (max). Ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds to prevent damage.
  • Use an ESD-protected workstation and follow proper handling procedures to prevent electrostatic discharge. The device has built-in ESD protection, but it is not a substitute for proper handling and storage procedures.
  • Store the device in a dry, cool place (−40°C to 30°C) with a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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NSVS50030SB3T1G Overview

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